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Micron to Invest ¥1.5 Trillion in New HBM Chip Facility in Hiroshima

Micron to Invest ¥1.5 Trillion in New HBM Chip Facility in Hiroshima

Post by : Meena Hassan

Micron Technology is set to undertake a significant investment in Japan, earmarking 1.5 trillion yen (around $9.6 billion) for the construction of a new semiconductor factory in Hiroshima. This facility will specialize in the production of cutting-edge high-bandwidth memory (HBM) chips, according to sources connected to the initiative.

Construction is slated to commence in May of next year at Micron's existing location in Hiroshima, with the aim of starting commercial shipments by 2028. Reports indicate that Japan's Ministry of Economy, Trade and Industry plans to support the project with up to 500 billion yen, aligning with its larger objective of revitalizing the country's semiconductor industry.

Japan has been making concerted efforts to rejuvenate its chip manufacturing by providing significant subsidies to international firms. In addition to supporting Micron, the government has also aided companies like TSMC and is funding the establishment of a new plant that will produce advanced logic chips utilizing IBM technology.

The rising demand for HBM chips is being driven by swift developments in artificial intelligence, cloud computing, and large-scale data centers. By bolstering its operations in Hiroshima, Micron aims to minimize its dependency on Taiwan while enhancing its competitiveness against prominent memory chip manufacturers such as SK Hynix.

The expanded facility is set to strengthen Japan's role as a vital entity in the rapidly evolving high-performance memory market, while also promoting diversification in the global supply chain.

Nov. 29, 2025 5:39 p.m. 1949
Global News

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